Datasheet for MR4A08B, 16 Mb, Parallel IO MRAM
Product Change Notices (PCNs)
PCN02967 Moisture Sensitivity Level of the 16Mb MRAM in the 48-BGA Package Upgraded to MSL-3.pdf
The 16Mb MRAM in the 48-BGA is being upgraded from MSL-5 to MSL-3.
PCN02968 Add OSE Assembly Site for 16Mb(x8) TSOP-44p Package.pdf
PCN02784 Mold Compound Change for 44pin TSOP2 for ASE-KH
To improve flexibility in manufacturing Everspin has qualified the 44 pin TSOP2 package from ASE-KH (Kaohsiung) with a new mold compound, G631H. This mold compound is already in use at other assembly sites.
PCN02542 Add TICP as a qualified source of the 16Mb X8 in the TSOP2 package
To increase production capacity and improve flexibility in manufacturing Everspin has qualified TICP as an additional assembly location for the 16Mb (x8) MRAM.
PCN1893 ALTERNATIVE FORMAT FOR TRACE CODES ON PACKAGE MARKING
Beginning December 30, 2011, Everspin may use an alternative Trace Code marking format interchangeably with the existing format. The existing format identifies fabrication site, assembly site, final test site and wafer lot, year and work week. The alternative format will identify the assembly site and wafer lot, year and work week. Affects all Everspin products and packages.
Everspin TSOP2 Package Guide.pdf
Thermal Resistance, Recommended reflow profile, package outline drawings for all TSOP2 packages from Everspin
EST 2130 Comparing_Technologies_FRAM_vs_MRAM_AppNote.pdf
Comparing MRAM to FRAM
EST 2902 Replacing the Cypress CY62168EV30LL-45BVXI MoBL SRAM with Everspin MR4A08B MRAM.pdf
EST 2902 Replacing the Cypress CY62168EV30LL-45BVXI MoBL SRAM with Everspin MR4A08B MRAM
EST02880 Magnetic Immunity for Everspin MRAM 073115.pdf
Replacing the Cypress CY14B108LA-xx 8Mb nvSRAM with Everspin's MR4A08Bxxx 16Mb MRAM
Replacing 8Mb nvSRAM with 16Mb MRAM in TSOP2 and FBGA packages.
Approximating the Magnetic Field When Using Everspin MRAM
How to create an approximation of the magnetic field strength surrounding an MRAM
technical articles & white papers
Cobham Toggle MRAM Quality and Reliability White Paper
Toggle MRAM Quality and Reliability Paper
A white paper discussing the reliability and qualification for Toggle MRAM components by Cobham
MRAM Improvements to Automotive Non-Volatile Memory Storage
Automotive powertrain modules use flash memory technology to retain critical control and diagnostic information during power off (keep-alive memory (KAM) and non-volatile memory (NVM)). Complex software must be designed to maximize the lifecycle of these devices because they have a limited number of write cycles. MRAM (Magneto resistive Random Access Memory) has the potential to eliminate this complexity and make the process of managing KAM and NVM easier and more robust. This paper demonstrates using off-board MRAM devices with a next generation of powertrain microprocessor. The prototype boards integrating the latest powertrain microcontroller, with the Everspin MRAM MRA16A (2 pcs of x16 bits) and MR2xH50 (@ a SCK 40MHz) chips were created. An investigation was performed evaluating the MRAM capabilities for storing and retrieving data during simulated key-off and key-on events.
Toggle and Spin-Torque MRAM: Status and Outlook
Article by J.M. Slaughter, et.al., of Everspin Technologies
RoHS / REACH
Everspin Technologies REACH Statement
Everspin Conflict Minerals Report Fiscal 2019.pdf
Everspin Conflict Minerals Report Fiscal 2019
Everspin Technologies RoHS Statement
EICC Product Level Master
EICC Company Level Master
Everspin CFSI_CMRT by Product 4.10_09232016.xls
Everspin CFSI_CMRT Company Level 4.10_09232016.xls
RoHS Red Phosphorous statement